Flexible Electronics Defect Analysis

Identification of contamination and defects in flexible electronic components and materials.

A key issue for manufacturers of polymer or flexible electronics components is the control of contamination and defects, and the identification of the sources of these in the production process. Intertek's materials analysis laboratories have vast experience of solving problems associated defect and fault analysis, and in the application of this expertise to the flexible electronics and flat panel display markets.

Flexible electronic material contamination and defect problems identified: 

• Contamination identification and characterisation (particulates and chemicals)
• Delamination
• Substrate non uniformity
• Additive migration
• Manufacture residues
• Grain size
• Adhesive failure
• Filler agglomeration
• Cracks/Pinholes
• Coating discontinuity
• Entrapped gas (voids/bubbles)
• Grain boundary
• Damage (scratches etc)