Adhesives Analysis and Formulation

Expertise applied to developing and understanding adhesive formulations through in-depth testing, analysis and research

Adhesive formulations analysis is key to a wide range of industries - from packaging to the electronics industries - in regard to integrity, mixing and consistency and ensuring more control over a wide variety of potential future issues. Adhesives can be difficult to evaluate in terms of categorization and lasting strength due to their variety and complexities, and accordingly, a multi-disciplinary approach is required, encompassing aspects such as the examination of adhesive interfaces, assessment of mixing plus the categorization and visualization of failure mode.

Intertek adhesives and formulation scientists examine adhesives for applications ranging from packaging to the electronics industries. We conform to strict discretionary measures: your adhesive projects and test-data are kept confidential. 

In order to build a complete picture of the adhesive bond, our scientists use a range of microscope based methods - sometimes in conjunction with peel testing - along with FTIR, NMR, chromatography and inorganic analysis in the course of failure analysis and troubleshooting procedures. 

Mass spectrometry (either MALDI-TOF or LC-MS) may be employed to yield information about the build-up of oligomers during cure. This can include bulk oligomers and the formation of low levels of adducts during mixing. We may also use techniques such as Differential Scanning Calorimetry (DSC) or Thermographic Analysis (TGA) to study changes in physical properties that can occur during the cure process.

Additionally, we perform accelerated aging and determine the rate of cure as part of the overall assessment to establish durability.

    Adhesive Testing and Research in industry 

    • The development of good conductivity and bond strength of adhesives used in the electronics industry, including adhesive and cohesive bonding
    • An understanding of wood-glue action and penetration at the adhesive/wood interface
    • Distribution of conductive particles in electronic adhesives
    • Root-cause of inconsistent peel in microwave food container films
    • Development of low-temperature adhesive processing for the cardboard packaging industry
    • Peel testing in order to measure adhesive toughness as a function of position throughout a delamination process
       

      Intertek’s knowledge and insight into adhesives analysis, research and problemsolving has resulted in considerable benefits for industry, with examples including:

      Electronics Industry conductive adhesive
      Intertek identified poor mixing as the cause of inconsistent conductivity and weak interface with copper substrate

      Wood Glue
      The lab showed how adhesion at the interface can be improved by understanding how the adhesive penetrates into the cellular structure

      Microwavable food trays
      Intertek advised on the development of easy-peel tray lids by studying the interaction between film lid and container

      Cardboard packaging
      Intertek helped the customer reduce the temperature of processing, resulting in significant energy savings

       
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