Adhesives Analysis and Formulation
Adhesive formulations analysis and research.
Intertek adhesives scientists examine adhesives for applications ranging from packaging to the electronics industries. Adhesive projects and test-data are kept confidential for our clients. Intertek's adhesives testing expertise helps prove and improve adhesive formulations and products, and better understand competitor formulations.
Adhesive research, testing and analysis:
- Categorization of failure modes
- Examination of adhesive interfaces
- Assessment of mixing
- Visualization of failure mode
Adhesive testing and research:
- The development of good conductivity and bond strength of adhesives used in the electronics industry, including adhesive and cohesive bonding
- An understanding of wood-glue action and penetration at the adhesive/wood interface
- Distribution of conductive particles in electronic adhesives
- Root-cause of inconsistent peel in micro-wave food container films
- Development of low-temperature adhesive processing for the cardboard packaging industry
- Peel testing
Adhesives analysis research and problem-solving:
- Electronics Industry conductive adhesive:
- Intertek identified poor mixing as the cause of inconsistent conductivity and weak interface with copper substrate
- Wood Glue:
- The lab showed how adhesion at the interface can be improved by understanding how the adhesive penetrates into the cellular structure
- Microwavable food trays:
- Intertek advised on the development of easy-peel tray lids by studying the interaction between film-lid and container
- Cardboard packaging:
- Intertek helped the customer reduce the temperature of processing, resulting in significant energy savings
Analytical services:
Contact us to see how Intertek can help your organization with Adhesives Analysis and Formulation.