Peel Testing
Accurate quantitative measurement of peel strength is an important tool in the characterisation of adhesives, and also in the investigation of adhesive failure and delamination
Purpose-designed fixed-arm peel instrumentation allows Intertek to accurately measure adhesive toughness as a function of position throughout a delamination process. By making careful corrections for both elastic and plastic deformations that occur during the process it is possible to calculate the intrinisic material parameter correctly
Mechanical peel measurements are routinely used in conjunction with microscopy (to examine surface morphology) and Surface Analysis techniques (to determine surface chemistry) in order to build up a complete picture of the behaviour of an adhesive bond.
Applications of peel measurements include:
- Characterisation of bonding strength of adhesives
- Investigation of adhesive failue processes
- Labelling applications
Mechanical Testing
Contact us to see how Intertek can help your organization with Peel Testing.