Flexible Electronics Defect Analysis

Identification of contamination and defects in flexible electronic components and materials.

A key issue for manufacturers of polymer or flexible electronics components is the control of contamination and defects, and the identification of the sources of these in the production process. Intertek's materials analysis laboratories have vast experience of solving problems associated defect and fault analysis, and in the application of this expertise to the flexible electronics and flat panel display markets.

Flexible electronic material contamination and defect problems identified: 

  • Contamination identification and characterisation (particulates and chemicals)
  • Delamination
  • Substrate non uniformity
  • Additive migration
  • Manufacture residues
  • Grain size
  • Adhesive failure
  • Filler agglomeration
  • Cracks/Pinholes
  • Coating discontinuity
  • Entrapped gas (voids/bubbles)
  • Grain boundary
  • Damage (scratches etc)
 

Contamination and materials analysis:

Need help or have a question? +1 800 967 5352
 

Need help or have a question?

+1 800 967 5352
EMEA UK:
+44 161 721 5247
Benelux:
+31 88 126 8888
APAC:
+65 6805 4800
Germany:
0800 5855888
+49 711 27311 152
Switzerland:
+41 61 686 4800
Mexico:
01 800 5468 3783
+52 55 5091 2150
Brazil:
+55 11 2322 8033
Australia:
+61 1300 046 837
India:
+91 (22) 4245 0204
UAE
+971 4 317 8777